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CT for electronicsMake your electronic components more reliable

CT for electronicsMake your electronic components more reliable

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Defects that are getting harder and harder to detect

Electronic components keep getting more compact, more complex and more integrated. Connectors, circuit boards, BGA components, power electronics and embedded systems now contain many areas that traditional inspection can’t see.

With CT, inspect the invisible

Industrial X-ray CT is a non-destructive testing (NDT) solution that lets you inspect the inside of components without disassembly. It helps manufacturers detect assembly defects, qualify new designs and speed up failure analysis of the most critical electronic systems.
Composant electronique vu en tomographie
Explore our CT systems: micro-CT, nano-CT, high-energy CT, custom-made.
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Meeting the challenges of the electronics industry with CT

<strong>Detect hidden defects</strong><br><br>A large share of defects sit beneath components or inside assemblies.-image
Detect hidden defects

A large share of defects sit beneath components or inside assemblies.
<strong>Qualify new designs</strong><br><br>Miniaturization makes inspection more complex.-image
Qualify new designs

Miniaturization makes inspection more complex.
<strong>Reduce destructive analysis</strong><br><br>Critical components are often costly or hard to replace.-image
Reduce destructive analysis

Critical components are often costly or hard to replace.
<strong>Make products more reliable before market launch</strong><br><br>Identify defects before they cause field failures.-image
Make products more reliable before market launch

Identify defects before they cause field failures.

Why CT in electronics? Reduce quality risks and improve product reliability

In electronics, internal defects can stay invisible until the product fails. CT detects these anomalies earlier and secures the development, qualification and production phases.

RX Solutions CT lets you:
  • Detect solder and assembly defects before functional testing.
  • Limit destructive analysis on high-value components.
  • Speed up failure analysis without complex disassembly.
  • Qualify new electronic designs before industrialization.
  • Reduce the risk of field failures with a more complete inspection of assemblies.
  • Improve supplier quality by analyzing incoming components and subassemblies.

With CT, preparing a sample requires nothing more than a fixture to hold it between the X-ray tube and the detector. It’s a non-destructive process that can be automated, and the part can go back into the production flow if no defect is found.


What CT brings to
Your electronics applications

electronics_tomography_benefits_carte_RX_Solutions_microCT

Inspect

The inside of boards, components and assemblies, without disassembly.

Analyze

Failure mechanisms of electronic systems.

Detect

Voids, solder defects, delamination and foreign material.

Qualify

New products before production launch.

Improve

The reliability of components and assembly processes.

For your electronics application

Which RX Solutions CT system?

Inspection needs vary widely depending on the size of the electronic components, the level of detail required and material density. RX Solutions offers several complementary ranges so you can precisely match the performance of the CT system to your application.

We’ll help you choose your CT system.

Every electronics project has different constraints in terms of resolution, board size, material density and level of analysis. Our engineers run trials on your parts to advise you better.
We are used to working under NDA.


Contact us to receive a personalized recommendation directly ↓

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Custom-made CT systems

Electronics projects for production, or beyond the standard?

Heavily encapsulated assemblies, multi-material devices, specific automation needs or integration right next to a production line: every project can come with its own constraints.

RX Solutions supports manufacturers and labs in developing custom solutions suited to their inspection, automation and qualification constraints. We have also developed versions of our CT systems adapted to the production environment with the FAB Series.

Our custom-made projects   Discover the FAB Series

From failure analysis to production: CT across your electronics workflows

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Cut long, costly investigations


When a defect appears on a board or component, CT gives you immediate access to the inside of the assembly without disassembly or destruction. Quality and R&D teams identify the root of the problem faster and make decisions sooner.

Examples
  • locate a broken bond wire inside an encapsulated component;
  • understand the origin of a solder defect on a multilayer board;
  • identify an internal defect without opening or damaging the component.
carte_electronique_telephone_electronics_validation_composant_avant_serie_tomography_RX_Solutions_microCT

Qualify new products before industrialization


As components become more compact and more integrated, validating new designs gets more complex. CT helps check internal assemblies, solder joints and hidden structures before production launch.

Examples
  • validate a new board design before series production;
  • inspect the assembly quality of an embedded electronic module;
  • qualify a new interconnection or encapsulation process.
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Make the most critical components more reliable


CT detects defects that are invisible in an external inspection and improves understanding of failure mechanisms. A valuable aid in strengthening the reliability of electronic products for automotive, e-mobility, aerospace and industry.

Examples
  • detection of voids in BGA solder joints;
  • inspection of a critical connector for an electric vehicle;
  • inspection of an embedded electronic component before qualification.
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Inspect without disassembling


Non-destructive inspection avoids damaging components and lets you keep samples for further testing, quality analyses or future expert assessments.

Examples
  • full analysis of a circuit board without desoldering components;
  • inspection of an electromechanical assembly without disassembly;
  • verification of a component returned from the field before expert analysis.
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Supporting R&D and production alike


From prototyping to qualification and quality control of series components, CT provides the data you need to understand, validate and improve electronic products throughout their life cycle.

Examples
  • validation of a prototype before industrialization;
  • qualification of a new generation of power electronics;
  • recurring quality control on critical series components.

Want to understand the origin of a defect, qualify a new electronic design or make your assemblies more reliable?

Talk to an RX Solutions expert

CT Typical applications in electronics

BGA (Ball Grid Array) solder inspection and miniaturized components
BGA (Ball Grid Array) solder inspection and miniaturized components
Multilayer circuit boards
Multilayer circuit boards
Embedded electronics and power electronics
Embedded electronics and power electronics
Batteries and capacitors
Batteries and capacitors
Connector systems
Connector systems
BGA (Ball Grid Array) solder inspection and miniaturized components
Modern electronic components pack in ever more compact assemblies that are hard to inspect. CT lets you analyze BGA solder balls and detect internal voids, connection defects and assembly issues that conventional inspection methods can’t see.
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Multilayer circuit boards
Inspecting multilayer PCBs means reaching internal layers that visual methods can’t access. CT lets you check internal connections, identify potential short circuits and quickly locate defects without disassembling the board.
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Embedded electronics and power electronics
Automotive, e-mobility, aerospace or industry: critical electronic systems must meet high reliability requirements. CT lets you verify assemblies, solder joints, connectors and power components before they enter service. 

Automotive
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Batteries and capacitors
CT lets you study how energy storage components evolve without disassembly. Post-mortem analysis, aging monitoring, electrode inspection or in-situ studies: it supports R&D as well as product qualification. 

Batteries
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Connector systems
Connectors, pins, cables and interconnection systems can be inspected without disassembly to check the integrity of electrical contacts and quickly detect defects likely to disrupt system operation.
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Why choose RX Solutions for your electronics applications?


Electronics inspection is about more than detecting a solder defect. It means inspecting multilayer boards, miniaturized components and ever more complex assemblies while keeping a usable image quality.

  • A solution suited to every scale of analysis: from miniaturized chips to large electronic boards. Discover our ranges
  • Better defect detectability: Horus improves the readability of complex assemblies and reduces artifacts on multi-material structures.
  • See what conventional methods can’t reach: BGAs, TSVs, multilayer boards and encapsulated components inspected without disassembly.
  • A platform that evolves with your needs, thanks to the support of our Care & Performance team: new detectors, automation, metrology, AI and software upgrades.
  • Custom-made solutions for non-standard projects: dedicated laminography, large electronic boards, robotic integration or specific research and production needs.
Micro-CT, nano-CT, high-energy CT, custom-made: discover our CT systems.

Electronics FAQ

Can a broken bond wire be detected without opening the package?
Yes. Radiography and CT let you inspect the inside of a component or assembly without disassembly to quickly locate broken wires, connection defects or assembly anomalies.
Is CT suited to BGA components and miniaturized assemblies?
Yes. CT is particularly effective for inspecting BGA solder balls, detecting voids, analyzing solder defects and checking connections that can’t be inspected visually.
Can a multilayer circuit board be inspected without disassembling it?
Yes. CT lets you view internal layers, hidden connections and encapsulated components without damaging the board. It is an ideal solution for failure analysis and qualification of new designs.
How can I analyze an electronic defect without destroying the component?
CT provides a complete view of the component’s internal structure so you can pinpoint the origin of the defect. It speeds up quality investigations while keeping the sample intact.
Can power electronics components be inspected?
Yes. Power modules, IGBTs, circuit boards, connectors and embedded systems can be inspected to verify assemblies, solder joints and critical internal structures.
Can CT track the aging of a battery or capacitor?
Yes. In-situ analyses and repeated acquisitions let you study how certain components evolve over time and better understand their degradation mechanisms.
Which RX Solutions range should I choose for my electronics application?
  • Nano: for chips, microelectronics, TSVs and miniaturized components.
  • Explorer: for most electronic boards, assemblies and failure analyses.
  • Force: for assemblies that need more penetration.
Can quality control of electronic components be automated?
Yes. RX Solutions CT systems can integrate different levels of automation to increase productivity, standardize inspections and improve the repeatability of quality controls.
Why use CT rather than a microscope?
A microscope only lets you observe what is visible on the surface. CT gives access to the whole volume of the component, including hidden areas, internal layers and defects invisible from the outside.
Is CT only used in R&D?
No. It is used for research and development as well as product qualification, failure analysis and quality control before or during production.

Want to make your electronic components more reliable before market launch?


Circuit boards, BGAs, power electronics, batteries or embedded systems: our experts help you identify critical defects, qualify your products and choose the CT solution best suited to your application. 
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