X-ray micro-tomography at Renault Group
The analysis of electronic parts follows the same pattern as the analysis of mechanical parts. In other words, it always starts with level 1 analysis: analyses using non-destructive means.
In the case of electronic parts, the main technologies used are radiography and micro-focus X-ray Computed Tomography. This allows us to observe the internal features of parts and components to detect defects and better understand the failure mechanisms in a non-destructive way. This allows when authorized, more intrusive analyses, targeting the samples very precisely so as not to destroy the defects and the signatures’ failures.
As electronics are more and more integrated, the challenge is to visualize smaller and smaller defects, and therefore to have technologies that can reach very high resolutions.