X-Ray Computed Tomography (CT) and Digital Radiography (DR) provide interesting results in order to help electronics experts
Live X-Ray Digital Radiography being available on all RX Solutions systems, it is very easy to detect broken bond wires or identify delamination issues by taking images of a component. The process is non-destructive, can be automated and if the supposed defective connection is not found then the part can be released without any modification. Moreover, preparing a sample to be scanned is no more than finding a support to hold it between the X-Ray tube and the detector.
Standard microscope inspection is often used in electronics but do not give same results because the majority of its components are hidden under other components, insulation or circuit boards. These superimposed features are not a limitation for X-Ray CT which can provide a three-dimensional model of any electrical connector or chip within a few minutes.
RX Solutions systems are designed to perform the best X-Ray Computed Tomography available on the market. With such technology electronics experts are now able to distinguish voiding due to gas bubbles in the solders, test Through-Silicon Vias (TSV) and find foreign object debris inside an electronic device without opening it.